ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,097, issued on Aug. 25, was assigned to ENTEGRIS INC. (Billerica, Mass.). "Method and device to regulate purge into a container" was invent... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,098, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing system and condition monitoring method" was inve... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,099, issued on Aug. 25, was assigned to NGK INSULATORS Ltd. (Nagoya-City, Japan). "Wafer placement table" was invented by Reo Watanabe (Han... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,100, issued on Aug. 25, was assigned to KOKUSAI ELECTRIC Corp. (Tokyo). "Substrate processing apparatus, substrate processing method, metho... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,101, issued on Aug. 25, was assigned to SHINKO ELECTRIC INDUSTRIES Co. LTD. (Nagano, Japan). "Electrostatic chuck and substrate fixing devi... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,102, issued on Aug. 25, was assigned to KWANGWOON UNIVERSITY INDUSTRY-ACADEMIC COLLABORATION FOUNDATION (Seoul, South Korea). "Cryogenic el... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,103, issued on Aug. 25, was assigned to Infineon Technologies Austria AG (Villach, Austria). "Semiconductor device having a detachable foil... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,104, issued on Aug. 25, was assigned to BONDTECH Co. LTD. (Kyoto, Japan). "Chip bonding system and chip bonding method" was invented by Aki... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,105, issued on Aug. 25, was assigned to DOW TORAY Co. LTD. (Tokyo). "Integrated dicing die bonding sheet and method for producing semicondu... Read More
ALEXANDRIA, Va., Aug. 25 -- United States Patent no. 12,721,106, issued on Aug. 25, was assigned to Tokyo Electron Ltd. (Tokyo). "Substrate processing apparatus and transfer method" was invented by T... Read More